Direct diffusion bonding of Ti{sub 3}SiC{sub 2} and Ti{sub 3}AlC{sub 2}

Two typical layered ternary compounds, Ti{sub 3}SiC{sub 2} and Ti{sub 3}AlC{sub 2}, were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100-1300 deg. C for 30-120 min under 10-30 MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM), energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD), the optimal condition for direct joining of Ti{sub 3}SiC{sub 2} and Ti{sub 3}AlC{sub 2} was obtained. Strong joints of Ti{sub 3}SiC{sub 2}/Ti{sub 3}AlC{sub 2} can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti{sub 3}SiC{sub 2}/Ti{sub 3}AlC{sub 2} joints was determined.