Flip-chip led module

A flip-chip LED module comprising: a substrate and flip-chip LED chips (2) provided on the substrate (1). The flip-chip LED module also comprises: a fluorescent powder layer (3). The fluorescent powder layer (3) covers at least two of the flip-chip LED chips (2); and, the fluorescent powder layer is provided with a fluorescent powder at the areas of the flip-chip LED chips. As such, with the fluorescent powder layer covering directly the flip-chip LED chips, a work process of applying the fluorescent powder is obviated, the evenness of the fluorescent powder on the flip-chip LED chips is ensured, production efficiency is increased, and usage of the fluorescent powder is reduced.