Topology optimization of swing-arm in LED die bonder

With the development of packaging technology, LED lighting technology is widely used. The accuracy of die bonding in LED packaging equipment directly influences the bonding quality of LED. The swing-arm is an important component in LED die bonder and its dynamic characteristics directly affects the piece accuracy. The accuracy and efficiency of LED die bonder are limited because of the vibration of the swing-arm. In this paper, the topology optimization of the swing-arm is analyzed by using the analysis software ANSYS. The optimized structure of swing-arm is obtained by topology optimization. The stiffness of the swing-arm is improved.