Tuning Wireless Intra-Chip Channels with Programmable Metasurfaces

Communication on multi-core chips is a severe bottleneck for computational performance. A potential solution, wireless radiofrequency links between far apart cores, suffers from strong multipath effects within the chip package that cause inter-symbol interference. We propose to empower the on-chip propagation environment with in situ programmability by equipping it with a programmable metasurface. By locally tuning the boundary conditions of the metallic enclosure that the chip package constitutes, the programmable metasurface allows us to tailor the on-chip channel impulse response. Our numerical studies suggest that this approach may overcome the caveat of current wireless interconnects.