Old Web
English
Sign In
Acemap
>
Paper
>
Development of high reliability semiconductor devices by copper wire bonding.
Development of high reliability semiconductor devices by copper wire bonding.
1988
Jitsuho Hirota
Y. Shibutani
T. Sugimura
Kazumichi Machida
Takio Okuda
Keywords:
Semiconductor device
Copper
Wire bonding
Metallurgy
Materials science
copper wire
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]