Z-Axis Interconnection in Organic Packaging

Greater I/O density at the die level, more demanding performance requirements, and the continued desire to package more function into smaller devices is driving the need for improved wiring density and a concomitant reduction in feature sizes for electronic packages. Traditionally, greater wiring densities have been achieved by reducing the dimensions of vias, lines, and spaces, while also increasing the number of wiring layers. However, each of these methods possesses inherent limitations in today's most challenging multi-chip module (MCM) and system-in-package (SiP) applications that also demand reduction in size, weight and power (SWaP). These applications are forcing new methods to be developed for achieving greater wiring densities while also meeting the cost for performance challenges that exist within this industry. One method of extending wiring density beyond the limits imposed by today's traditional approaches is the strategy of making metal-to-metal z-axis interconnection of subcomposites durin...