A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package

We present a static frequency divider operating up to 29 GHz in a tiny leadless plastic package. This innovative package, which is intended for high volume production at low cost, has an ultra-miniaturized footprint with a standard pad pitch of 0.5 mm and a standard package height of 0.4 mm. To demonstrate the high frequency capabilities of the package we show the performance up to 29 GHz of a frequency divider with a divide ratio of 16. The circuit is manufactured in a standard SiGe BiCMOS technology for volume production (Infineon B7HFC).