High-order stitching overlay analysis for advanced process control
2011
In recent years, layer-to-layer overlay methods moved from the linear regime into non-linear high-order methods in order
to meet the shrinking overlay requirements. In this study we investigate a large number of metrology structures in the
overlapped scribe-line between adjacent scanner fields and the opportunity for improved overlay performance. Sampling
and modeling considerations are discussed. In this investigation we consider the opportunities for high-order stitching
analysis in process control and scanner monitoring. The goal of this work is to establish a systematic methodology for
high order stitching to characterize and reduce overlay errors for advanced IC manufacturing.
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