遷移的液相焼結法によるAl-4.5%Cu合金の製造

The transient liquid phase (TLP) sintering of Al–4.5 mass%Cu alloy using pure Al powder and Cu powders has been made. In the present investigation, hot pressing was used for the TLP from above the eutectic temperature (821 K) to under it (solid state (SS) sintering) to reveal the effect of liquid phase on sintering characteristics. As a result, the microstructures were composed of α–Al solid solution and CuAl2 (θ–phase) in any conditions. We confirmed that the characteristic structures which consisted of Cu-poor phase in the vicinity of grain boundaries of α–Al solid solution. The θ–phase formed at the grain boundary by the SS sintered alloy was more continuous than that of the TLP sintered alloy. On the other hand, the Vickers hardness of the SS sintered alloy was slightly larger than that of the TLP sintered alloy. However, the tensile strength, the elongation and the reduction of area of the TLP sintered alloy were higher than on the SS sintered alloy. These results indicate that the liquid phase formed during sintering accelerates effectively the sintering process.