Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation

The conventional failure analysis methods are not efficient in analyzing Systems on Chip (SoC) ICs. Electrical failure analysis using a Fault Diagnosis Tool (FDT) and Product Characterization Board can help to precisely localize the defect. Failure analysis of two BiCMOS products using these methods will be demonstrated in this paper. Detail analysis of using these two methods are presented and discussed.