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Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing
Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing
2018
Justin Mallek
Donna-Ruth W. Yost
Danna Rosenberg
Greg Calusine
Matthew Cook
Rabindra N. Das
Evan Golden
David Kim
Alexander Melville
Corey Stull
Wayne Woods
Jonilyn Yoder
William Oliver
Keywords:
Superconductivity
Quantum computer
Silicon
Electronic engineering
Materials science
Optoelectronics
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