Thermosetting resin composition and an optical semiconductor adhesive

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of potting molding and of forming an optical semiconductor-sealing material which is colorless and transparent, and has excellent UV durability and heat resistance; and to provide an optical semiconductor element sealed with the same. SOLUTION: The thermosetting rein composition contains (A) a polyorganosiloxane having an epoxy equivalent of at most 1,600 g/mol, and (B) a metal chelate compound. The optical semiconductor element is sealed with the composition. COPYRIGHT: (C)2008,JPO&INPIT