A method for fine polishing / -strukturieren heat-sensitive dielectric materials by means of laser radiation

For fine polishing / -strukturieren heat-sensitive dielectric materials, in particular with a low coefficient of thermal expansion, by means of laser radiation is shown according to the invention a method is directed to a surface to be worked of the material in the intense ultrashort laser radiation and the exposure time of the laser radiation on the surface in the range of 10 With the inventive method, a material removal is carried out in the nanometer range with ultrashort laser pulses in the picosecond and subpicosecond range, wherein the material surface is finely polished during a praablativen process step (removal below the ablation threshold). Due to the extremely short exposure time of the laser radiation on the surface to be treated a very small warming takes place, which is only in the range of some 10 degrees.