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Effect of Tempering Temperature on Microstructure and Uniformity of LP Steel Plate under HOP Process
Effect of Tempering Temperature on Microstructure and Uniformity of LP Steel Plate under HOP Process
2021
Jie Xiong
Shuai Tang
Chengyuan Wu
Ronghui Xu
Xinjun Sheng
Zhengyu Liu
Guodong Wang
Keywords:
Composite material
Tempering
Hop (telecommunications)
Process (computing)
Microstructure
Materials science
Correction
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