Study of mutual coupling on mobile phone PCB with shielding using FDTD

The coupling mechanisms on a commercial mobile phone PCB with different shielding configurations has been investigated with FDTD simulation in this paper. A modified PCB based on the commercial PCB was manufactured for validation purposes prior to the simulation. Good agreement between simulation and measurement was obtained. The coupling performance of the commercial PCB was then reproduced with numerical simulations. A simplified PCB model was developed to investigate the phenomena observed in the simulation results of the commercial PCB. The investigation explains the difference of the coupling mechanisms with and without shielding and the effect of perforated shielding on the coupling.