Electrical Resistance of Polymeric Compounds Filled with SHS-Produced TiC–Al2O3 Powders

SHS-produced TiC–Al2O3 powders were used as a filler of organosilicon polymers and ethoxyline resin to prepare electroconducting polymeric compounds. The electrical conductivity of thus prepared polymeric compounds was found to depend on the amount of added ceramic powder, temperature, and type of polymer binder. A threshold effect observed for the temperature dependence of compound resistance can be used in designing temperature sensors and temperature/current-limiting devices. Our polymeric compounds can also be recommended as a material for film heaters with a working temperature of below 300°С.