Old Web
English
Sign In
Acemap
>
Paper
>
Compact Transient Thermal Model of Micro-Fluidically Cooled 3D Stacked Chips with Pin-Fin Enhanced Micro-Gap
Compact Transient Thermal Model of Micro-Fluidically Cooled 3D Stacked Chips with Pin-Fin Enhanced Micro-Gap
2021
Yuanchen Hu
Obaidul Hossen
Zhimin Wan
Muhannad S. Bakir
Yogendra Joshi
Keywords:
Fin
thermal model
micro gap
Materials science
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]