Temporary attachment adhesives, the adhesive layer, a method of manufacturing a wafer processed body and a semiconductor device using the same, rework solvent, a polyimide copolymer, a polyimide mixed resin, and the resin composition

The present invention is excellent in heat resistance, one of bonding the semiconductor circuit forming substrate and the supporting substrate with an adhesive layer without the adhesive force is also changed through the manufacturing process of a semiconductor device, then under mild conditions at room temperature a temporary attachment adhesives which can be peeled off in, to provide a method of manufacturing a semiconductor device using the same. The present invention has at least an acid dianhydride residue and the diamine residue, the polysiloxane diamine is a natural number represented n is 1 to 15 in the diamine residue (A1) General formula (1) residual a polyimide copolymer comprising both groups and (B1) residues of polysiloxane diamine is a formula 100 following a natural number represented n is 16 or more (1), the residue of (A1) 40 containing 99.99 mol%, a temporary attachment adhesive, which is a polyimide copolymer containing 0.01 to 60 mole% residues of (B1).