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Stress analysis of a diffusion bonding device under loading and thermal expansion.
Stress analysis of a diffusion bonding device under loading and thermal expansion.
2017
Gabriel Serafin Couto Vieira
G. G. V. Nuernberg
Nelson Yurako Londono Pabon
Marcia B. H. Mantelli
Keywords:
Thermal expansion
Diffusion bonding
Materials science
Composite material
Correction
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