Device packaged by injection molding electronic parts, injection-molding tool and method for packaging electronic components

Device packaged by means of injection molding technology electronic components (2), wherein a plurality of electronic components (2) on a first side (6) of the system carrier (4) is arranged in predetermined positions, and the system carrier (4), conductor tracks, contact connection surfaces for connection to contact surfaces having the electronic components (2) and vias for attaching external contact areas and / or bumps on a second side (8) of the first side (6) situated opposite, wherein the system carrier (4) is a ceramic substrate on the first side (6) is covered with a plastic layer, wherein the ceramic substrate at least two layers (16, 18, 20), each having different coefficients of thermal expansion, wherein a first ceramic layer (16) containing the covered with the plastic layer first side (6) of the system carrier (4), has a higher thermal expansion coefficient than the b enachbarte at least one further ceramic layer (18).