Method of forming semiconductor device having embedded interposer

PURPOSE: A formation method of a semiconductor device is provided to improve the reliability of a solder joint by including a semiconductor chip or a semiconductor package by using conductive adhesives on an embedded interposer. CONSTITUTION: A printed circuit board(11) is formed by laminating a lamination layer(27) on a base substrate(21). The embedded interposer(10) is attached to the printed circuit board. A semiconductor chip(51) or a semiconductor package is installed by using conductive adhesives(55) on the embedded interposer. The embedded interposer has a same coefficient of thermal expansion with the semiconductor chip. The embedded interposer is formed by using the semiconductor wafer.