Hand-operated solder paste screen printing platform for surface mounted technology

A hand-operated solder paste screen printing platform for surface mounted technology is provided. The platform comprises a pedestal and a framework able to cover on the pedestal. A silk screen plate is embedded in a surface of the framework that contacts with the pedestal. Outer edges of the silk screen plate fit with inner edges of the framework. A set of solder paste holes are carved in the silk screen plate, and solder paste can flow out of the solder paste holes. The silk screen plate has three layers, which are a first copper foil layer, an epoxy resin layer and a second copper foil layer successively. The platform is simple in structure, small in size, low in production and maintenance cost, free of place limitation, and suitable for solder paste applying and production of most surface-mounted printed circuit boards. Through the solder paste holes, a proper amount of solder paste can be easily printed on circuit board in need of surface mounting, so that waste is avoided. Almost no toxic or hazardous substances are discharged during usage, and the silk screen plate can be reused when being well kept, which is very environment-friendly.