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214 Warpage analysis of an electronic package considering thermal history
214 Warpage analysis of an electronic package considering thermal history
2014
Akiko Ozaki
Shinya Kawahara
Toru Ikeda
Noriyuki Miyazaki
Takuya Hatao
Keywords:
Thermal
Viscoelasticity
Materials science
Composite material
electronic packages
Curing (food preservation)
Correction
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