Polishing head and method for plasma polishing an inner surface of a workpiece

The invention relates to a polishing head and a method for plasma polishing an inner surface of a workpiece using a cathode and an anode, wherein a workpiece to be processed forms the anode and the polishing head having a cathode contact, and an electrolyte supply. According to the method, the polishing head is located concentrically in the region of the inner surface of the workpiece, wherein the workpiece to be processed forms the anode when a voltage. Consequently, the polishing head acts as a cathode and is supplied via an electrolyte supply permanently with a volume flow of the electrolyte, wherein the electrolyte flows against the inner surface to be machined of the workpiece.