The photosensitive resin composition, a photosensitive element, a resist pattern manufacturing method and a printed wiring board manufacturing method

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in productivity and also having good resolution and adhesion and a photosensitive element using the same. SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable, ethylenically unsaturated bond in one molecule, (C) a photopolymerization initiator and (D) a hindered amine compound. The photosensitive element is obtained by forming a resist layer consisting of a layer of the photosensitive resin composition on a support.