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A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical Polishing
A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical Polishing
2012
Chuljin Park
Minhyon Jeon
Sangjik Lee
Doyeon Kim
Taekyung Lee
Hyoungjae Kim
Keywords:
Chemical-mechanical planarization
Composite material
Wafer
Materials science
Optics
Correction
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