Effects of Electrodeposition Conditions on Properties of Ni Thin Films Electrodeposited from Baths Fabricated by Dissolving Metal Ni Powders

Korea Atomic Energy Research Institute, Daejeon, 305-353, Korea(Received June 16, 2015 ; revised June 25, 2015 ; accepted June 29, 2015)AbstractChloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and de-ionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloridebaths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin wasdecreased with increasing the current density. Residual stress of Ni thin films ware measured to be about230 ~ 435 MPa in the range of current density of 10 ~ 25 mA/cm