Fully integrated Air Pumped Heat Exchanger (PHUMP)

The ever-increasing computational power of modern electronics entails an associated increase in heat generation in the chip; microprocessors without a thermal management system are easily capable of melting themselves. Exotic thermal management systems such as liquid cooling allow high thermal power densities but require large volumes and complex implementations. The Fully Integrated Air-Pumped Heat-Exchanger (PHUMP) heat sink allows this cost-effective technology to keep pace with the cooling demands of the advancing electronics industry.