Packaging and design of a heterogeneous dual laser chip for a widely tunable spectrally pure optical RF source

In this paper, we report the results of the efforts to extend our previous work through the packaging and redesign of a heterogeneously integrated silicon-photonic circuit for use in a modulation side-band injection-locked optical RF generation system. Towards that effort, we attempted to improve the RF spectrum coverage of our design by decreasing the laser cavity length. Despite the unintended formation of an additional parasitic cavity in that device, we demonstrated increased spectrum coverage between 5 and 50 GHz in a packaged module with an ∼1-Hz linewidth.