Curable resin composition and the sealant

PROBLEM TO BE SOLVED: To provide a curable resin composition which has high heat resistance, is excellent in flexibility and mechanical strength, and can be suitably used even for a semiconductor sealing material having high heat resistance.SOLUTION: The curable resin composition contains an epoxy resin and a curing agent. The curing agent contains a phenolic resin and an aromatic amine compound. The curable resin composition is obtained by a production method including the steps of: mixing a phenolic resin and an aromatic amine compound to obtain a mixture; and mixing the mixture and an epoxy resin.