Influence of segregation and diffusion behavior on electrical properties
2012
The segregation and diffusion of Ni-Cr embedded thin film resistor (ETFR) materials under different annealing conditions were investigated. Strong segregation and diffusion were caused by annealing at high temperature. The electrical properties of Ni- Cr ETFR were affected by segregation and diffusion of metal, which led unstable TCR and large resistivity.
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