Resistive switching characteristics of Pt/CeOx/TiN memory device

The resistive switching characteristics of Pt/CeOx/TiN memory devices are investigated for potential applications in nonvolatile resistive random access memory (RRAM). The X-ray diffraction characteristics of the sputtered CeOx layer indicate the formation of nanocrystalline single-phase CeO2 with a cubic fluorite structure. The existence of oxygen vacancies in the Pt/CeOx/TiN memory device was determined by X-ray photoelectron spectroscopic studies, while the presence of an interfacial layer between CeOx and the TiN bottom electrode was investigated by X-ray diffraction and high resolution transmission electron microscopy. The TiON layer formed at the TiN/CeOx interface seems to play a key role in the resistive switching mechanism of the device. The present CeOx-based device shows excellent bipolar resistive switching characteristics, including a low operation current (100 ?A), high ON/OFF resistance ratio (?105), and good retention/stress characteristics at both room temperature and 85 ?C.