Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder

The present study highlights the changes in morphology in a Sn matrix during pulsed electrodeposition of a Sn–Cu near-eutectic alloy with varying current density in an acidic electrolyte. 3D image construction has been employed using SHAPE V7.3; Shape Software: Kingsport, Tennessee, USA to replicate the shape of grown crystals and analyze the results. It is observed that the growth morphology changes with the introduction of high index planes at higher current densities. Furthermore, a growth pattern occurs with high index planes formed from a stepped structure in low index planes. There has been a change in growth direction from ⟨001⟩ to ⟨110⟩ at higher current densities. At very high current densities, sympathetic or secondary nucleation is observed.