Non-contact silicon chip thickness and resistivity detection system

The utility model provides a non-contact silicon chip thickness and resistivity detection system which comprises a testing module. A signal processing module is connected with the testing module; a control module is connected with the signal processing module; the testing module comprises a base; upper and lower capacitive sensors are arranged on the base by probe fixing frames; the upper and lower capacitive sensors are connected with a first signal processing unit by an amplifying circuit; upper and lower eddy current sensors are also arranged on the base by probe fixing frames; the upper and lower eddy current sensors are connected with a second signal processing unit by an oscillating circuit; the control module comprises a microprocessor; and both an analog-digital and digital-to-analog conversion processor and an LCD (Liquid Crystal Display) touch screen are connected with the microprocessor. The system provided by the utility model can be used for carrying out non-contact testing on the thickness, the thickness deviation and the resistivity of a crystal-silicon solar silicon chip only by operation for once and has the characteristics of strong anti-interference capacity, strong adaptive capacity to environment, low fault rate, convenience for operation and low maintenance cost.