Chemical mechanical polishing aqueous dispersion, a manufacturing method and a chemical mechanical polishing method

The present invention contains abrasive grains composed of (A) 100 parts by weight of inorganic particles containing ceria, (B) 5 to 100 parts by weight cationic organic polymer particles and (C) an anionic water-soluble compound 5-120 parts by weight chemical mechanical polishing aqueous dispersion of about. The above chemical mechanical polishing aqueous dispersion, preferably (A) 0.1 to 10 wt% inorganic particles containing ceria and (A) 5 to 100 parts by weight per 100 parts by weight of the inorganic particles (B) cation first solution containing sexual organic polymer particles are prepared by a method comprising the step of adding a second solution containing 5 to 30 wt% (C) anionic water-soluble compounds.