Packaged technology for installing after-construction monitoring instruments in high-thickness loess deep filling layer

The invention discloses packaged technology for installing after-construction monitoring instruments in high-thickness loess deep filling layer. The technology includes the following steps that after a placing line is located, a rotary drilling rig is adopted for well completion; in the well completion process, two grooves are formed in the wall of a well, soil layer sensors and connected cables are all embedded in the grooves, residue soil at the bottom of the well is removed after the well is formed to the depth, after the well is completed, a worker work protective bin is installed, the well is ventilated for 20 minutes, and then pilot run of the work protective bin is performed in a non-loaded state; after pilot run succeeds, a worker carrying an interphone enters the work protective bin to install the sensors; and after the sensors are installed, in-hole backfilling is performed, and after in-hole earthwork backfilling is finished, initial numbers of all the sensors are measured, and data measurement work is then started. By the adoption of the packaged technology, personnel operation safety can be guaranteed, the embedding efficiency and the survival rate of the instruments can be improved to a great extent, and the packaged technology is suitable for installation of deep filling layer deformation monitoring instruments and other related instruments and equipment.