Stiction forces and reduction by dynamic contact in ultra-clean encapsulated MEMS devices

We demonstrate the consistent and manageable nature of surface adhesion and stiction forces in MEMS devices fabricated using the high-temperature epitaxial encapsulation process. In this encapsulation process (commercialized by SiTime), there are no chemical anti-stiction films or getters. Data from more than 2000 test structures with more than 80 design variations from three different fabrication runs were gathered in this study. Surprisingly, the adhesion force is shown to be independent of design geometry. The measured adhesion forces (18–25uN) are small enough for inertial sensors. In addition, we demonstrate anti-stiction bump stops with springs for a sliding contact, which reduce the probability of stiction by over 50%.