Microelectronic chip, component including such a chip and method of manufacture

Microelectronic chip (3) comprising: ▪ a substrate (4) semiconductor; ▪ at least one region (10) of its surface adapted to be electrically connected to a metal frame (2) arranged to receive said chip (3); ▪ at least one connection zone (6) formed of a layer (7) conductive copper-based, comprising a connecting member (8), said connection zone (6) being connected to said region (10) by a conductive track (11), wherein said region (10) is formed by a layer (12) forming a barrier to diffusion of copper interposed between the connection zone (6) and the substrate (3