Microstructure and Electron Energy-Loss Spectroscopy Analysis of Interface Between Cu Substrate and Al2O3 Film Formed by Aerosol Deposition Method

Aerosol deposition method is a technique to form dense films by impacting solid particles on a substrate at room temperature. To clarify the bonding mechanism between AD films and substrates, TEM observation and electron energy-loss spectroscopy (EELS) analysis of the interface between Al2O3 AD films and Cu substrates were conducted. The Al2O3 film was directly adhered to the Cu substrate without any void or crack. The film was composed of randomly oriented α-Al2O3 crystal grains of about 10-20 nm large. At the Al2O3/Cu interface, the lattice fringes of the film were recognized, and no interfacial layer with nanometer-order thickness could be found. EELS spectra near O-K edge obtained at the interface had the pre-peak feature at around 528 eV. According to previously reported experiments and theoretical calculations, this suggests interactions between Cu and O in Al2O3 at the interface. It is inferred that not only the anchoring effect but also the ionic bonding and covalent bonding that originates from the Cu-O interactions contribute to the bonding between Al2O3 AD films and Cu substrates.