Pick-Up and Placement Improvement: An Industrial Case Study

Surface mount technology, usually on the context of Pick-up and Placement, is used on printed circuit boards assembling. In this paper, some aspects and physical parameters related with the pick-up and placement process are analysed in detail throughout the entire work sequence, such as the different variants of these same components among the various suppliers under study. In this process, there are problems of rejection and quality. The aim of this work is to identify and analyse these types of components, as well as their differences and possible causes for their misplacement on the printed circuit boards. Measurements and analyses were performed in lab tests and the study focused more on the capacitors’ assembling details. Experimental tests were carried out on the production line in order to obtain conclusive results regarding the study of nozzles and placement of components. Finally, it was concluded that nozzles 907 present a good behaviour in resistors and nozzles 925 present a good behaviour in capacitors.