Influence of copper stress on ultra-structure of wheat seedlings.

Transmission Electron Microscope (TEM) Technology was used to investigate the effect of 25、100 and 200 mg/kg copper on ultrastructure of root tip and leaf blade of wheat. result showed that serious damage was found with Copper of 25、100 and 200 mg/kg. Plasmolysis ,concentrated cytoplasm,Chloroplast inflation,lamellar structure disturbance,capsule disappearance and disintegtration,mitochondria Structures ambiguity and vacuolization were all symptoms under Cu stress. There were positive correlation between concentration of copper stress and the degree of injury,and the degree of injury of copper were different in different organelles. Mitochondria was the most sensitive organelles,and there was patient difference in the same organelles of different parts.