Electrolyte and methods for depositing tin-copper alloy layers, and use of the electrolyte

The present invention describes an acidic electrolyte for deposition of tin-silver alloys, the salts of one or more alkyl sulphonic acids and / or alkanol sulphonic acids, one or more soluble tin (II), one or more soluble silver (I) salts and one or more organic sulfur compounds having one or more thioether functions and / or ether functions of the general formula -RZR'- (R and R 'are the same or different non-aromatic organic radicals, Z is S or O) comprises. Furthermore, a method employing the electrolyte, and the coating obtainable by the process and to the use of electrolyte for coating electronic components is provided.