Packaging structure for fingerprint identification sensor

The invention discloses a packaging structure for a fingerprint identification sensor, and belongs to the technical field of semiconductor packaging. A fingerprint identification sensor chip is embedded into a packaging body from the back surface; the upper surface, not including an induction region and electrodes, of a silicon-based body, and the upper surface of the packaging body are covered with an insulating layer; a re-wiring metal layer I is selectively distributed on the surface of the insulating layer, and electrically connected with the corresponding electrodes; through holes are formed in the periphery of the fingerprint identification sensor chip and penetrate through the packaging body and the insulating layer; a re-wiring metal layer II is selectively distributed on the lower surface of the packaging body; one end of a metal layer is connected with the re-wiring metal layer I while the other end of the metal layer is connected with the re-wiring metal layer II; and a high K dielectric layer is arranged above the induction region. According to the packaging structure, the effects of improving reliability, lowering packaging thickness, improving sensitivity and the like are achieved.