Packaging method for chip scale packaging LED

The invention provides a packaging method for a chip scale packaging LED. The packaging method comprises the following steps that (1) a layer of fixing film used for fixing the position of LED chips is arranged on a carrier plate; (2) multiple LED chips are distributed on the surface of the fixing film, and the LED chips are distributed in arrays and gaps are reserved between the adjacent LED chips; (3) a layer of light blocking glue is covered on the LED chip arrays; (4) after the light blocking glue is solidified, the surface layer of the light blocking glue is removed through grinding so that the top surface of the LED chips is enabled to be exposed; (5) a layer of fluorescent glue layer is covered on the light blocking glue layer and the top surface of the LED chips; (6) and cutting is performed along the gaps between the adjacent LED chips, and cutting depth is to the fixing film so that the fluorescent glue layer and the light blocking glue layer can be cut off. With application of the technology, multiple single-side light-emitting LEDs can be manufactured simultaneously, and the single-side light-emitting LEDs can be used as light sources as for products with higher light incident requirement.