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Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs
Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs
1995
Gaku Minamihaba
Yoshiaki Shimooka
Hitoshi Tamura
Tadashi Iijima
Takashi Kawanoue
Hideaki Hirabayashi
Naoaki Sakurai
H. Ookawa
Takashi Obara
H. Egawa
Toshiaki Idaka
Takeshi Kubota
Toshio Shimizu
Mitsutoshi Koyama
G. Ooshima
Kyoichi Suguro
Keywords:
Nanotechnology
Composite material
Materials science
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