Method for manufacturing stepped circuit board

The invention discloses a method for manufacturing a stepped circuit board, and belongs to the technical field of circuit board production processes. The method for manufacturing the stepped circuit board is characterized by comprising the following steps of (1) board cutting, (2) hole drilling, (2) primary pattern transfer, (4) graph electroplating, (5) film stripping, (6) secondary pattern transfer, (7) etching, (8) film stripping and (9) detection on whether the circuit width and the circuit distance of a circuit reach the standard or not. The method for manufacturing the stepped circuit board is simple in technological process, free of grinding boards, low in manufacturing cost and applicable to manufacturing stepped circuit boards.