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Solder Bump Defects in Ceramic Flip Chip Packages and Their Acoustic Signatures
Solder Bump Defects in Ceramic Flip Chip Packages and Their Acoustic Signatures
2003
Kartik Ramanujachar
Darwin Rusli
Reena Agarwal
James Widaski
Keywords:
Optoelectronics
Flip chip
Ceramic
Materials science
Soldering
Correction
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