The (Limited) Evidence Regarding Effects of Grade-Span Configurations on Academic Achievement: What Rural Educators Should Know. ERIC Digest.

In a method of fabricating semiconductor laser chips using a circular semiconductor wafer, an orientation flat is formed at a part of the peripheral side surface of the semiconductor wafer so that an alignment error of the orientation flat from a crystalline axis of the semiconductor wafer is within+/-0.04 DEG . Therefore, the processing precision in fabricating semiconductor laser chips using the circular wafer is improved.