A Kind of Multi-disciplinary Simulation and Design Platform for IC Chamber based on Commercial Solver.

In this paper, a kind of multi-disciplinary simulation and design platform for wafer manufacturing process with Chamber system is presented. This platform is developed as an in-house program, with different functional component for multi-disciplinary problems, which can drive the commercial FEM solver with code. There are also management function for user, products, and analysis or optimization process templates. This platform can be used for analyzing the multidisciplinary process inside chamber system, DOE and optimization analysis for wafer manufacturing process, product and analyzing process template management. 1 Background With the rapid development of manufacturing technology, the IC manufacturing process become a kind of very complex and high-accuracy process, which is composed with many different displinary problems, including fluid and thermal field, electric-magnetic field, and plasma field. Chamber is the main reaction part for wafer manufacturing process, such as PECVD, PVD, LPCVD, and etching[CY01]. There are plenty of factors in multi-field inside the chamber, which can affect the wafer fabricating performance. To improve quality of wafer fabrication, it should be considered in a multi-disciplinary interaction perspective[CY02][WT03]. In this paper, a kind of multi-disciplinary simulation and design platform for wafer manufacturing process with Chamber system is presented. This platform is developed as an in-house program, with different functional component for multi-disciplinary problems, which can drive the commercial FEM solver with code. There are also management function for user, products, and analysis or optimization process templates. This platform can be used for analyzing the multi-disciplinary process inside chamber system(such as thermal-fluid, magnetic, and plasma), DOE and optimization analysis for wafer manufacturing process, product and analyzing process template management[MS04].