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Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
2005
Taiichiro Watanabe
Keita Motonami
Kazuhiro Sakamoto
Jun Deguchi
Risato Kobayashi
Ken Komiya
Keiji Okumura
Takafumi Fukushima
Hiroyuki Kurino
Hajime Mushiake
Mitsumasa Koyanagi
Keywords:
Electronic engineering
Chip
Microsystem
Brain implant
Materials science
Biomedical engineering
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